At STC, we monitor all clean room activity with the goal of achieving superior product yields. Equally important, both general and specific device tests systematically ensure high quality MEMS that satisfy customer needs.
During process development and optimization, STC uses optical and scanning electron microscopy plus electrical and electronic measurement capabilities, paying careful attention to specific application requirements. To ensure production repeatability, STC employs a full complement of in-line metrology equipment to routinely monitor each of the critical parameters that affect performance and quality.
Alfa Step Profilometers
- KLA Tencor P-10 & P15
CD Measurement/ Elemental Analysis
- Hitachi FESEM with EDAX
CD Overlay
- IVS 135 CD Overlay
CD Scope
- Nikon Eclipse 200
Electrical Characterization
- MDC CV Tester
- Suss Probe Station
Film Thickness and Stress
- Woolam Ellipsometer
- N&K 1500
- Nanospec 210
- Flexus 2620
Optical Profiling
- ZYGO Optical Interferometer
Photoresist Thickness
- Flimetrics F50
Surface Resistivity
- CDE Resmap 16
Wafer Thickness
- MTI Autoscan 200
Wire Bond Tester
- Dage Precision Industries 4000
- Wire Bond Pull Tester
